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| M62023L/P/FP System Reset IC with Switch for 3V Memory Back-up REJ03D0528-0200 Rev.2.00 Jun 15, 2007 General Description The M62023L/P/FP is a system reset IC that controls the memory backup function of an SRAM and an embedded RAM of a microcontroller. The IC outputs reset signals (RES/RES) to a microcontroller at power-down and power failure. It also shifts the power supply to RAMs from main to backup, outputs a signal (CS) that invokes standby mode, and alters RAMs to backup circuit mode. Features * * * * * * Built-in switch for selection between main power supply and backup power supply to RAMs Small difference between input and output voltages (IOUT = 80mA, VIN=3V): 0.15V typ. Detection voltage (power supply monitor voltage): 2.57V typ. Chip select signal output (CS) Two channels of reset outputs (RES/RES) Power on reset circuit. Application Power supply control systems for memory of microcontroller systems in electronic equipment such as OA equipment, industrial equipment, and home-use electronic appliances and SRAM boards with built-in backup function that require switching between external power supply and battery. Block Diagram SW VIN 3 R1 Com Reset Circuit R2 1.24V 8 CS D1 2 VBAT 1 VOUT RES RES 7 5 Delay Circuit 4 Ct 6 GND REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 1 of 12 M62023L/P/FP Pin Arrangement M62023L 8 CS 7 RES 6 GND 5 RES 4 Ct 3 VIN 2 VBAT 1 VOUT (Top view) Outline: PRSS0008AA-A (8P5) [L] VOUT 1 VBAT 2 VIN 3 Ct 4 (Top view) Outline: PRDP0008AA-A (8P4) [P] PRSP0008DE-C [FP] (recommend) PRSP0008DA-A (8P2S-A) [FP] (not recommend for new design) M62023P M62023FP 8 CS 7 RES 6 GND 5 RES Pin Description Pin No. 1 Symbol VOUT Name Power supply output Function VIN and VBAT are controlled by means of an internal switch and output through VOUT. The pin is capable of outputting up to 100mA. Use it as VDD of CMOS RAM and the like. Backup power supply is connected to this pin. If a lithium battery is used, insert a resistor in series for safety purposes. +3V input pin. Connect to a logic power supply. A delay capacitor is connected to this pin. By connecting a capacitor, it is possible to delay each output. Connect to the positive reset input of a microcontroller. The pin is capable of flowing 1mA sink current. Reference for all signals. Connect to the negative reset input of a microcontroller. The pin is capable of flowing 1mA sink current. Connect to the Chip Select of RAM. The CS output is at low level in normal state thereby letting RAM be active. Under failure or backup condition, the CS output is set to high level, then RAM enters standby state disabling read/write function. The pin is capable of flowing a 1mA sink current. 2 3 4 5 6 7 8 VBAT VIN Ct RES GND RES CS Backup power supply input Power supply input Delay capacitor connection pin Positive reset output Ground Negative reset output Chip select output REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 2 of 12 M62023L/P/FP Absolute Maximum Ratings (Ta = 25C, unless otherwise noted.) Item Input voltage Output current Power dissipation Thermal derating Operating temperature Storage temperature Symbol VIN IOUT Pd K Topr Tstg Ratings 7 100 800 (L) / 625 (P) / 440 (FP) 8 (L) / 6.25 (P) / 4.4 (FP) -20 to +75 -40 to +125 Unit V mA mW mW/C C C Ta 25C Conditions Electrical Characteristics (Ta = 25C, unless otherwise noted.) Item Detection voltage Hysteresis voltage Circuit current Difference between input and output voltage Ct output voltage (high level) Ct output voltage (low level) RES output voltage (high level) RES output voltage (low level) RES output voltage (high level) RES output voltage (low level) CS output voltage (high level) CS output voltage (low level) Backup Di leak current Backup Di forward direction voltage Delay time Response time RES limit voltage of operation Sysbol VS VS ICC VDROP VOH(Ct) VOL(Ct) VOH(RES) VOL(RES) VOH(RES) VOL(RES) VOH(CS) VOL(CS) IR VF tpd td VOPL (RES) Min 2.44 50 -- -- -- -- 2.0 -- 1.5 -- -- 2.5 -- -- 1.3 2.40 -- -- -- -- -- 10 -- -- Typ 2.57 100 1.5 6.5 0.1 0.15 2.4 0.02 2.0 0.02 0.04 3.0 0.02 0.04 1.6 2.47 0.07 0.08 -- -- 0.54 27 5.0 0.65 Max 2.70 200 3.0 10 0.2 0.3 -- 0.1 -- -- 0.2 -- -- 0.2 -- -- -- 0.3 0.5 0.5 0.6 55 25.0 -- Unit V mV mA Test Conditions VIN (At change from HL) VS = VSH - VSL IOUT = 0mA VIN = 2V VIN = 3V VIN = 3V * 1 1 V V V V V V V V V A V ms s V VIN = 3V IOUT = 50mA IOUT = 80mA VIN = 2V * 1 VIN = 2V * VIN = 3V * VIN = 3V, Isink = 1mA VIN = 3V * 1 1 1 VIN = 2V * VIN = 2V, Isink = 1mA VIN = 2V * 2 VIN = 0V, VBAT = 3V * VIN = 3V * VIN = 3V, Isink = 1mA VBAT = 3V IF = 10A VIN = 0V3V, Ct = 4.7F VIN = 3V2V * 3 1 2 VIN = 3V VIN = 0V Notes: 1. Regarding conditions to measure VOH and VOL, voltage values are generated by internal resistance only and no external resistor is used. 2. These values are produced inserting an external resistor, RCS = 1M, between the CS pin and GND. 3. With no external resistor (10k internal resistance only). REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 3 of 12 M62023L/P/FP Application Example +3.0V (Main Power Supply) 3 D1 CIN*1 VDD R2 MCU or CPU 1.24V RES 7 5 RES Delay Circuit M62023 VIN R1 SW 1 Com Reset Circuit VOUT Battery 3V VBAT 2 CS COUT*1 VDD 8 4 Ct CMOS RAM GND 6 Ct REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 4 of 12 M62023L/P/FP Configuration Ct output VO (Ct) (V) 3.0 Vs VSL VSH 2.0 1.0 0 2.4 2.5 2.6 2.7 2.8 2.9 Input voltage VIN (V) Delay time (tpd) = CtxR3xIn [VOH(Ct)-VOL(Ct)] [VOH(Ct)-INV1(VTH)] 3 Note: Ct is an external capacitance. Taking into consideration the time taken by the oscillator of microcomputer to be stable, connect a 4.7F capacitor to the Ct pin. (As the response time of detection can be slowed due to internal structure depending on the rising rate of power supply, avoid connecting a too large capacitance.) tpd VOH (Ct) INV1 (Vth) VOL (Ct) Delayed output waveforms of Ct REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 5 of 12 M62023L/P/FP Internal Circuit Ct 4 VIN 3 RES 5 RES 7 Q4 R1 25.6k R3 22k Com R6 47k R7 10k R8 10k 1 VOUT VR R4 0 Q1 R5 10k D1 R10 800 Q2 INV1 INV2 INV3 INV4 R11 10k 2 VBAT Q3 R2 24k Vref 1.24V INV5 INV6 INV7 INV8 INV9 R9 5k R10 22k Q5 8 CS 6 GND REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 6 of 12 M62023L/P/FP Timing Chart tpd 3V VSH VSL VIN 0V Vs tpd V1 VOUT V2 V3 CS V2 V3 VOL(CS) 3V VIN(VSL) RES VOL(RES) VOH(RES) VIN(VSL) RES VOL(RES) V1=VIN-VDROP V2=VIN-VEB(SW Tr.) V3=VBAT-VF Input voltage In normal operation Output pin Input voltage: 3V In failure (instantaneous drop) Input voltage: 3V2V Each output varies if the input voltage drops to VSL or under Restoration from failure (instantaneous drop) Input voltage: 2V3V If the input voltage goes higher than VSL by 100mV, each output varies after delay produced by the delay circuit. SW Tr. is turned ON after delay and a voltage (VIN-VDROP) is output. A logic high is maintained, and then shifts to a logic low. In backup state Input voltage: 0V Backup voltage: 3V VOUT With SW Tr. set to ON, a voltage (VIN-VDROP) is output. The output level is VOL (RES) with a logic low. SW Tr. is turned OFF. A voltage (VIN-VEB) is output by the diode between E and B of SW Tr. As the state shifts from a logic low to logic high, the output level becomes approximately equal to the input voltage. As the state shifts from a logic high to logic low, the output level becomes VOL(RES) As the state shifts from a logic low to logic high, the output level becomes the voltage VIN-VEB. VBAT-VF RES RES The output level is VOH(RES) with a logic high. The output level is VOL(CS) with a logic low. A logic low is maintained, and then shifts to a logic high. A logic high is maintained, and then shifts to a logic low. The output is a logic high and the output level is VBAT-VF CS REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 7 of 12 M62023L/P/FP Typical Characteristics Thermal Derating (Maximum Rating) 1000 Power dissipation P d (mW) M62023L 800 M62023P 600 M62023FP 400 200 0 0 125 100 75 Ambient temperature Ta (C) 50 25 Detection Voltage vs . Ambient Temperature 2.64 Detection voltage Vs (V) Hysteresis Voltage vs . Ambient Temperature 140 130 120 110 100 v 2.63 2.62 2.61 2.60 2.59 2.58 2.57 2.56 -20 0 20 40 60 80 100 Tj = 25C 90 80 70 60 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Ambient temperature Ta (C) 10 Circuit current Icc (mA) Circuit Current vs. Ambient Temperature VIN = 3V Circuit current Icc (mA) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 Circuit Current vs. Ambient Temperature VIN = 2V 9 8 7 6 5 4 3 2 -20 0 20 40 60 80 100 0 -20 0 20 40 60 80 100 Ambient temperature Ta (C) Ambient temperature Ta (C) REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 8 of 12 M62023L/P/FP Output Current vs. Difference Between Input and Output Voltages 100 Difference Between Input and Output Voltages vs. Ambient Temperature 400 VIN = 3V 350 VIN = 3V Output current IOUT (mA) Difference between input and output voltages VDROP (mV) 0 50 100 150 200 250 80 60 40 20 0 300 250 IOUT=100mA 200 IOUT=80mA 150 IOUT=50mA 100 50 0 -20 0 20 40 60 80 100 Difference between input and output voltages VDROP (mV) Ambient temperature Ta (C) 160 140 Backup Di forward direction voltage VF (V) Backup Di Forward Direction Current vs. Voltage Backup Di Forward Direction Voltage vs. Ambint Temperature 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -20 0 20 40 60 80 100 Ambient temperature Ta (C) IF=1A IF=100A IF=10A c d f 120 100 80 60 40 20 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Backup Di forward direction voltage VF (V) RES "L" output voltage VOL (RES) (mV) RES "L" output voltage VOL (RES) (mV) 80 70 60 50 40 30 20 10 0 RES "L" Output Voltage vs . Ambient Temperature 80 70 60 50 40 30 20 10 0 VIN=3V Isink =1mA RES "L" Output Voltage vs. Ambient Temperature VIN=2V Isink =1mA -20 0 20 40 60 80 100 Ambient temperature Ta (C) -20 0 20 40 60 80 100 Ambient temperature Ta (C) REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 9 of 12 M62023L/P/FP CS "L" Output Voltage vs. Ambint Temperature 160 140 120 100 80 60 40 20 0 -20 0 20 40 60 80 100 Ambint temperature Ta (C) VIN=3V Isink =1mA CS "H" Output Voltage vs. Ambient Temperature VIN=2V RCS=1M CS "H" output voltage VOH (CS) (mV) CS "L" output voltage VOL (CS) (mV) 4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 -20 0 20 40 60 80 100 Ambient temperature Ta (C) 1000 7 5 3 Delay Time vs. External Capacitance Connected to The Ct Pin 40 VIN=0V 3V Delay time tpd (ms) Delay Time vs. Ambient Temperature VIN=0V 3V Ct=4.7A 35 30 25 20 15 10 5 Delay time tpd (ms) 2 100 7 5 3 2 10 7 5 3 2 1 0.1 2 3 57 1 23 57 10 23 57 100 0 External capacitance connected to the Ct pin Ct (F) -20 0 20 40 60 80 100 Ambient temperature Ta (C) REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 10 of 12 M62023L/P/FP Package Dimensions JEITA Package Code P-SIP8-6.4x19-2.54 RENESAS Code PRSS0008AA-A Previous Code 8P5 MASS[Typ.] 0.73g 19.0 0.2 2.8 0.2 6.4 1.2 Min 2.54 0.5 0.1 0.85 +0.3 -0.1 3.0 Min 8.3 Max 1.2 0.1 +0.07 -0.05 1.2 +0.1 -0.3 0.27 JEITA Package Code P-DIP8-6.3x8.84-2.54 RENESAS Code PRDP0008AA-A Previous Code 8P4 MASS[Typ.] 0.5g 8 5 c 1 4 *1 e1 E *2 D NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. A Reference Symbol A2 Dimension in Millimeters SEATING PLANE *3 b 3 bp e *3 b 2 e1 D E A A1 A2 bp b2 b3 c e L Min Nom Max 7.32 7.62 7.92 8.7 8.9 9.1 6.15 6.3 6.45 4.5 0.51 3.3 0.4 0.5 0.6 0.9 1.0 1.3 1.4 1.5 1.8 0.22 0.27 0.34 15 0 2.29 2.54 2.79 3.0 REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 11 of 12 L A1 M62023L/P/FP JEITA Package Code P-SOP8-4.4x4.85-1.27 RENESAS Code PRSP0008DE-C Previous Code -- MASS[Typ.] 0.1g *1 D F 8 5 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. bp HE E *2 Index mark Terminal cross section ( Ni/Pd/Au plating ) 1 Z e 4 *3 c Reference Symbol Dimension in Millimeters bp x M L1 A1 L y Detail F D E A2 A1 A bp b1 c c1 HE e x y Z L L1 A A2 Min Nom Max 4.65 4.85 5.05 4.2 4.4 4.6 1.85 0.00 0.1 0.20 2.03 0.34 0.4 0.46 0.15 0.20 0.25 0 8 5.7 6.2 6.5 1.12 1.27 1.42 0.12 0.10 0.75 0.25 0.45 0.65 0.90 JEITA Package Code P-SOP8-4.4x5-1.27 RENESAS Code PRSP0008DA-A Previous Code 8P2S-A MASS[Typ.] 0.07g 8 5 HE *1 E F 1 Index mark 4 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c A2 A1 *2 D Reference Symbol Dimension in Millimeters *3 e y bp D E A2 A1 A bp c HE e y L Detail F Min Nom Max 4.8 5.0 5.2 4.2 4.4 4.6 1.5 0.05 1.9 0.35 0.4 0.5 0.13 0.15 0.2 0 10 5.9 6.2 6.5 1.12 1.27 1.42 0.1 0.2 0.4 0.6 A REJ03D0528-0200 Rev.2.00 Jun 15, 2007 Page 12 of 12 L Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Notes: 1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document. 2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including, but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples. 3. 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Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges. 10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 11. 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